ANCAMINE® 2264

Product Description (Web)
Ancamine® 2264 is a polycycloaliphatic polyamine designed for use in the elevated temperature cure of epoxy resins. The low viscosity and relatively long pot-lives at moderate temperatures coupled with the excellent mechanical properties and high heat resistance following cure make Ancamine® 2264 an ideal alternative to aromatic diamines.
Product information
  • Brochure
    • Epoxy curing agents product guide Americas
      Evonik offers a full line of high-quality, performance-orientated epoxy curing agents and modifiers for a wide range of applications, including marine and protective coatings, civil engineering and construction, adhesives, and composites.
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    • Epoxy curing agents product guide EMEA
      Evonik offers a full line of high-quality, performance-orientated epoxy curing agents and modifiers for a wide range of applications, including marine and protective coatings, civil engineering and construction, adhesives, and composites.
      ENdownload
    • Epoxy curing agents used in contact with food and potable water Americas
      Epoxy coatings are widely used for applications requiring contact with food or potable water.
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    • Structural Adhesives
      Our Ancamide®, Ancamine®, Amicure® and Curezol® product series offer a versatile toolbox for epoxy curing in structural adhesive applications including a wide range of aliphatic and cycloaliphatic amines to amidoamine and polyamide curing agents, complemented by
      dicyandiamide, substituted ureas, and imidazoles. These allow developers and manufacturers of structural epoxy adhesives to cope with a broad range of bonding applications and process requirements.
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    • Tailor-made curing agent solutions for structural epoxy adhesives
      Epoxy adhesives can be adapted to numerous requirement profiles with regard to processing and curing, and the required final properties of the bond can be adjusted. The curing agent can be used to specifically influence decisive properties of the adhesive.
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  • Product selection chart
    • Epoxy curing agents for adhesives
      Epoxy curing agents and modifiers for adhesive and sealants one component systems (1K) and two component systems (2K). They enable adhesive bonding of different substrates providing higher strength and flexibility.
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    • Epoxy curing agents for composites
      Epoxy curing agents for composites offer solutions for all technologies: filament winding, pultrusion, cure in place pipes, prepreg, sheet molding compound, infusion and resin transfer molding.
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  • Technical data sheet (TDS)