Dicyandiamide (DICY) for one component heat cure adhesives and composites
DICYANEX® is designed for use as a latent curing agent for epoxy resins with the finest particle size for maximum reactivity.
Product portfolio
Dicyanex® 1200 curing agent is a micronized grade of dicyandiamide containing 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing agent for epoxy resins.
Dicyanex® 1400B curing agent is a micronized grade of dicyandiamide containing 3% of an inert flow control additive to inhibit clumping and improved handling. It is designed for use as a latent curing agent for epoxy resins.
Dicyanex®1400F curing agent is a micronized grade of dicyandiamide containing 3-4% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing agent for epoxy resins.
Dicyanex® 200-X is a pulverized grade of dicyandiamide designed for use as a latent curing agent for epoxy resins in solvent-based processes.
Dicyanex® 325 curing agent is a pulverized grade of dicyandiamide containing 3% of an inert flow control additive to inhibit clumping and improve handling. It is designed for use as a latent curing agent for epoxy resins.
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Please note that products may not be available in every country. Consult with your area sales manager for further information.